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3D COPLANARITY INSPECTION  MODULE

UX-46MM - 3D COPLANARITY INSPECTION  MODULE

The UltraVim 3D inspection module uses vision cameras to perform 3D coplanarity inspections. The module calculates 3D BGA inspections and 3D lead inspections in seconds. Optional golden device units can be used to verify accuracy.

3D COPLANARITY INSPECTION  MODULE

VX-46MM - 3D COPLANARITY INSPECTION  MODULE

The UltraVim VX module can perform 3D coplanarity inspection and bent lead inspection on a variety of leaded device packages including QFP, TSOP and J-Lead devices. Standard device file libraries provide for easy setup and training.

3D-35MM - 3D INSPECTION  MODULE

The UltraVim 3D module can inspect a variety of leaded device packages including BGA, CSP, QFP, TSOP and SOIC packages in three dimensions using stereo cameras and advanced lighting.

3D COPLANARITY INSPECTION  MICROSCOPE

3D-40MM - 3D COPLANARITY INSPECTION  MICROSCOPE

The UltraVim 3D Microscope can inspect a variety of semiconductor packages including QFP, TSOP and SOP devices in three dimensions. Devices are placed on the glass and tested in real time.

2D LEAD INSPECTION  SYSTEM

2D-30MM - LEAD INSPECTION  SYSTEM

The UltraVim 2D system uses a machine vision camera to provide defect inspection, mark inspection and other 2D inspections. Standard device file libraries are included and the click and go interface allows users to setup the system in seconds.

2D LEAD INSPECTION  SYSTEM

2M-30MM - LEAD INSPECTION  SYSTEM

The UltraVim 2M system uses a machine vision camera to provide defect inspection, mark inspection and other inspections. Optional software can be used to quickly find XY and theta positions for a variety of devices and packages.

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