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V4 - 3D COPLANARITY INSPECTION
The UltraVim V4 module can inspect a variety of leaded device packages including BGA, CSP, QFN, LCC, QFP, TSOP and SOIC packages in three dimensions in less than one tenth of a second using stereo vision and an innovative diffractive light head.

 

UX - 3DCOPLANARITY INSPECTION
The UltraVim UX inspection module uses telecentric optics to perform coplanarity inspection on SMD devices with leads and balls. All our 3D and 2D systems use our UltraVim software with a standard part library for easy setup and training.

 

VX - 3DCOPLANARITY INSPECTION
The UltraVim VX module can perform coplanarity inspection and bent lead inspection on a variety of leaded device packages including QFP, TSOP and J-Lead devices. Standard part files use the specifications off the device drawing to test the device.

 

2D - LEAD INSPECTION
The UltraVim 2D system uses a machine vision camera to provide defect inspection, mark inspection and other 2D inspections. Standard device file libraries are included and the click and go interface allows users to setup the system in seconds.

 

2M - MARK INSPECTION
The UltraVim 2M system uses a machine vision camera to provide defect inspection, mark inspection and other inspections. The user simply draws a rectangle around the area of the image to inspect and the software calculates the correlation of all subsequent devices.

 

3D - MANUAL INSPECTION
The UltraVim 3D manual system can inspect the coplanarity of gull-wing SOP, TSOP and QFP devices. After the device is selected from the part library, it is placed on the glass plate using a vacuum pen and the software finds the coplanarity and bent lead and displays the pass or fail results.

 

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